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MC Silicone Professional Mould Making & Casting Materials Supplier
|Place of Origin:||China|
|Brand Name:||MC SILICONE|
|Minimum Order Quantity:||240|
|Packaging Details:||1kg/can , 5kg/can , 10kg/drum , 20kg/drum , 25kg/drum , 200kg/drum|
|Delivery Time:||about 3-5 working days after payment|
|Payment Terms:||L/C, , T/T, Western Union, PayPal , MoneyGram|
|Product Name:||Silicone Rubber 160||Color:||Grey|
|Viscosity:||3000-6000 Cps||Mixing Ratio:||1:1|
|Hardness:||50-60 Shore A||Working Time:||30-40mins|
|Volume Resistivity Ohm*cm:||1*1015||Thermal Conductivity Cm/°C:||0.525*10-3|
4000cps Led Encapsulation Silicone,
Waterproof Led Encapsulation Silicone,
4000cps Waterproof Silicone Potting Compounds
Silicone compound is supplied as a two-component addition cure system. It consists of Part A and Part B. The component A is white and component B is black for easy identification and inspection of complete mixing.(colors can be adjusted as per customer requirement.) When the components are thoroughly mixed in a 1:1 ratio by weight or volume, the liquid mixture cures to a flexible elastomer, which is suited for electrical/electronic potting and encapsulating applications.
Silicone is a general purpose compound suited for adhesive and coating. This cost-effective silicone can be used in a variety of electronic potting applications including the adhesive and coating for solar power, HID, LCD displayers, circuit board and electronic components, etc.
Silicone compound has a excellent electrical property features in resistant to temperature, corrosion, radiation, insulation, waterproof, damp proofing, shock resistance, thermal conducting, inflaming retarding and weather ability, etc. It can be long-term used under -50℃～200℃.
Thermal expansion properties
The coefficient of thermal expansion ranging of silicone compound is 5.9-7.9 x 10-4/°C. The coefficient of linear thermal expansion is about 1/3 of the coefficient of volume thermal expansion; it can be used for the overall linear thermal expansion calculation of rubber parts under a certain limits of temperature.
The following cure schedules may be used as a guideline; however, larger masses may require longer periods of time to reach temperature.
24 hours at 23-25℃
4-6 hours at 50℃
1-2 hours at 100℃
Faster if needed
25-30 mins at 60℃
18 mins at 70℃
5 mins at 80℃
Silicone compound part A and Part B should be thoroughly mixed at a 1:1 ratio (weight or volume) before using. Pour into the electronic components after vacuum de-airing. Silicone compound may be cured at room temperature or accelerated with heat.
Packing and Storage
Contact Person: Mrs. Amy Tse