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SGS Electronic Encapsulation Silicone Casting Compound Room Temperature Cure

SGS Electronic Encapsulation Silicone Casting Compound Room Temperature Cure

  • SGS Electronic Encapsulation Silicone Casting Compound Room Temperature Cure
  • SGS Electronic Encapsulation Silicone Casting Compound Room Temperature Cure
  • SGS Electronic Encapsulation Silicone Casting Compound Room Temperature Cure
SGS Electronic Encapsulation Silicone Casting Compound Room Temperature Cure
Product Details:
Place of Origin: China
Brand Name: MC SILICONE
Certification: MSDS , SGS, Reach
Model Number: MC-160
Payment & Shipping Terms:
Minimum Order Quantity: 100
Price: Negotiation
Packaging Details: 1kg/can , 5kg/can , 10kg/drum , 20kg/drum , 25kg/drum , 200kg/drum
Delivery Time: 5-10 working days
Payment Terms: L/C, , T/T, Western Union, PayPal ,
Supply Ability: 8000kgs/day
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Detailed Product Description
Color: Grey Viscosity: 3000-6000
Mixing Ratio: 1:1 Hardness: 50-60 Shore A
Working Time: 30-40mins Dielectric Breakdown Voltage Kv/mm 25°C: ≥20
Volume Resistivity Ohm*cm: 1*1015 Tensile Strength: ≥0.6
Thermal Conductivity Cm/°C: 0.525*10-3
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SGS silicone casting compound

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SGS 60a silicone casting compound

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SGS RTV160 silicone potting compound

Silicone potting compound for electronic encapsulation electronic components

 

Description of Electronic Potting Silicone Compound& Encapsulates

 

RTV160 is a two-component room temperature cure potting compound with mix ratio of 1:1, curing time can be accelerated by heating up, features with good flow ability and flame resistance. It’s suitable for encapsulating of LED displayers, power module and electronics components, etc.

 

Features of Electronic Potting Silicone Compound& Encapsulates

 

Easy mix with 1:1 proportion

Low viscosity, good flow ability

Room temperature cure or heat up cure

Thermal conduction, flame resistance

Without solvent

 

Using Instructions of Electronic Potting Silicone Compound& Encapsulates

 

1. Preparing: clean up the coating surface, remove the rust, dust, oil dirt.

 

2. Pouring: weigh the silicone and catalyst correctly, mix silicone part A and part B thoroughly, pour onto the electronic components/surface after vacuum degassing.

 

3. Curing: room temperature cure or heat-up cure is both workable.

 

It should be use up after open the package, the material must be kept in a cool place sealed well, and it should avoid from contactwithmoisture in the air.

 

 

 

Technical datasheet of Electronic Potting Silicone Compound& Encapsulates

 

Item No. RTV160
Before curing
Appearance A: brick red B: transparent
Viscosity (mPa.s 25°C) 3000~6000
Density (g/cm3 ) 1.57±0.02
Working life (min 25°C) 30
Curing time (hrs) 24
Heat-up at 100°C (min) 10
After curing
Hardness (shore A) 50~60
Dielectric breakdown voltage kv/mm 25°C ≥20
Volume resistivity ohm*cm 1*1015
Tensile Strength Mpa ≥0.6
Thermal conductivity cm/°C 0.525*10-3
Working temperature °C -30~200

 

Note: Mechanical and electrical performance data tested at 25°C 7 days after curing, relative humidity of 55%; all the tested data is average value.

 

Packaging of Electronic Potting Silicone Compound& Encapsulates

 

Packs are available in 20kg and 200kg per drum.

 

Storage & Transportation of Electronic Potting Silicone Compound& Encapsulates

 

Keep it from strong sunshine, heat, and store in cool & dry place, well sealed. It has a shelf life of 12 months.

It can be stroked and transported as non-dangerous goods.

 

 

Contact Details
MINGCHENG GROUP LIMITED

Contact Person: Mrs. Amy Tse

Tel: +86-18664910896

Fax: 86-769-82696808

Send your inquiry directly to us (0 / 3000)