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MC Silicone Professional Mould Making & Casting Materials Supplier
|Place of Origin:||CHINA|
|Minimum Order Quantity:||100kg|
|Packaging Details:||20kg/drum; 200kg/drum|
|Delivery Time:||3~5 DAYS AFTER PAYMENT|
|Payment Terms:||L/C, T/T, Western Union, MoneyGram|
|Application:||Encapsulant||Appearance:||Grey Liquid Rubber|
|Mixing Ratio:||1:1||Hardness:||56 Shore A|
|Viscosity:||3700±2000Cps||Working Time:||30-40 Mins|
|Curing Time:||2~4 Hours||Shelf Life:||12months Under 25C|
Grey Liquid Silicone Encapsulants,
Potting Compound Silicone Encapsulants,
Solar Power Silicone Encapsulants
Silicone compound is supplied as a two-component addition cure system. It consists of Part A and Part B. The component A is white and component B is black for easy identification and inspection of complete mixing.(colors can be adjusted as per customer requirement.) When the components are thoroughly mixed in a 1:1 ratio by weight or volume, the liquid mixture cures to a flexible elastomer, which is suited for electrical/electronic potting and encapsulating applications.
Silicone is a general purpose compound suited for adhesive and coating. This cost-effective silicone can be used in a variety of electronic potting applications including the adhesive and coating for solar power, HID, LCD displayers, circuit board and electronic components, etc.
Silicone compound has a excellent electrical property features in resistant to temperature, corrosion, radiation, insulation, waterproof, damp proofing, shock resistance, thermal conducting, inflaming retarding and weather ability, etc. It can be long-term used under -50℃～200℃.
|Mix ratio (A/B)||1:1|
|Pot life after curing(25℃,min)||30-40|
|Curing time (hrs)||2-4|
|Durometer Hardness(JIS A0)||56|
|Volume resistivity(Ω·cm)||7X10 14|
|Dielectric breakdown voltage(KV/mm)||≥20|
|Flammability classification||UL-94 V-0|
Thermal expansion properties
The coefficient of thermal expansion ranging of silicone compound is 5.9-7.9 x 10-4/°C. The coefficient of linear thermal expansion is about 1/3 of the coefficient of volume thermal expansion; it can be used for the overall linear thermal expansion calculation of rubber parts under a certain limits of temperature.
The following cure schedules may be used as a guideline; however, larger masses may require longer periods of time to reach temperature.
24 hours at 23-25℃
4-6 hours at 50℃
1-2 hours at 100℃
Faster if needed
25-30 mins at 60℃
18 mins at 70℃
5 mins at 80℃
Silicone compound part A and Part B should be thoroughly mixed at a 1:1 ratio (weight or volume) before using. Pour into the electronic components after vacuum de-airing. Silicone compound may be cured at room temperature or accelerated with heat.
Packing and Storage
Contact Person: Mrs. Amy Tse