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MC Silicone Professional Mould Making & Casting Materials Supplier
|Place of Origin:||China|
|Brand Name:||MC SILICONE|
|Minimum Order Quantity:||240|
|Packaging Details:||1kg/can , 5kg/can , 10kg/drum , 20kg/drum , 25kg/drum , 200kg/drum|
|Delivery Time:||about 3-5 working days after payment|
|Payment Terms:||L/C, , T/T, Western Union, PayPal , MoneyGram|
|Product Name:||Silicone In Primary Forms||HS Code:||39100000|
|Mixing Ratio:||1:1||Working Time:||60-120mins|
|Hardness:||56 Shore A||Dielectric Breakdown Voltage Kv/mm 25°C:||≥20|
|Thermal Conductivity（W/m·K）:||≥0.6||Curing Time:||Room Temperature Cure Or Heat Cure|
Silicone Potting Compound For Electronics,
Thermal Conductive Silicone Potting Compound,
2 Part Silicone Encapsulants
Silicone potting compounds and encapsulants provide a flexible, protective barrier or enclosure against a variety of environmental factors for electronic circuits and systems. These silicones are used when a deep section cure is required and prevent, debris, heat shock and vibration from damaging the electronics.
In addition to protecting electronic components, silicone potting compounds and encapsulants are used for other functionalities that may be required such as thermal transfer and light emission.
· Two-component addition type silicone potting compound.
· Mix ratio is 1:1
· Low hardening shrinkage.
· Excellent high temperature electrical insulation and high stability.
· Good waterproof and moisture-proof.
· Excellent flame retardant.
· Automotive electronics, modules.
· LED power driver module.
· Solar module junction box.
· Electric vehicle charging column module.
· Lithium battery and capacitor bank.
· Magnetic induction coil
· power inverters
In applications requiring adhesion, priming will be required for many of the silicone encapsulants. For best results, the primer should be applied in a very thin, uniform coating and then wiped off after application. After application, it should be thoroughly cured prior to application of the silicone encapsulant.
Thoroughly mixed silicone encapsulants may be poured/dispensed directly into the container in which it is to be cured. Care should be taken to minimize air entrapment. When practical, pouring/dispensing should be done under vacuum, particularly if the component being potted or encapsulated has many small voids. If this technique cannot be used, the unit should be evacuated after the silicone encapsulant has been poured/ dispensed. MC silicone encapsulants may be either room temperature (25 °C/77 °F) or heat cured.
USABLE LIFE AND STORAGE
Shelf life has 12 months after the production date.
Containers should be kept tightly closed and head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen. Exposure to moisture could reduce adhesion and cause bubbles to form.
Contact Person: Mrs. Amy Tse