LED Display Potting Silicone Encapsulant

Moisture Protection Dielectric Insulation Silicone Encapsulant 184 Clear Silicone Elastomer For LED Display Potting

Product Description
MCSIL-E184 Silicone Encapsulant, is supplying this product in 2-part separate liquid component kits, consisting of base and curing agents. When mixed thoroughly, the compound turns into a flexible elastomer. The mixing process should be done using a weight or volume ratio of 10:1.

COMPOSITION
Two-part
10 to 1 mix ratio
Polydimethylsiloxane elastomer

Applications

MCSIL-E184 Silicone Encapsulant is suitable for:
LED Lighting encapsulation
Power supplies
Connectors
Sensors
Industrial controls
Transformers
Amplifiers
High voltage resistor packs
Relays
Adhesive/encapsulant for solar cells
Adhesive handling beam lead integrated circuits during processing

Features

Flowable
Room temperature and heat cure
Good dielectric properties
Rapid, versatile cure processing controlled by temperature
High transparency allows easy inspection of components.

Technical datasheet of Electronic Potting Silicone Encapsulates

Note: Mechanical and electrical performance data tested at 25°C 7 days after curing, relative humidity of 55%; all the tested data is average value.

APPLICATION METHODS
Automated metered mixing and dispensing
Manual mixing

MIXING AND DE-AIRING
The 10 to 1 mix ratio these products are supplied in gives one latitude to tune the modulus and hardness for specific application needs and production lines. In most cases de-airing is not required.

PREPARING SURFACES
In applications requiring adhesion, priming will be required for many of the silicone encapsulants. For best results, the primer should be applied in a very thin, uniform coating and then wiped off after application. After application, it should be thoroughly cured prior to application of the silicone elastomer. Additional instructions for primer usage can be found in the information sheets specific to the individual primers.

PROCESSING/CURING
Thoroughly mixed silicone encapsulant may be poured/dispensed directly into the container in which it is to be cured. Care should be taken to minimize air entrapment. When practical, pouring/dispensing should be done under vacuum, particularly if the component being potted or encapsulated has many small voids. If this technique cannot be used, the unit should be evacuated after the silicone encapsulant has been poured/dispensed. Silicone encapsulants may be either room temperature (25°C/77°F) or heat cured. Room temperature cure encapsulants may also be heat accelerated for faster cure.

POT LIFE AND CURE RATE
Cure reaction begins with the mixing process. Initially, cure is evidenced by a gradual increase in viscosity, followed by gelation and conversion to a solid elastomer. Pot life is defined as the time required for viscosity to double after base and curing agent are mixed and is highly temperature and application dependent.

LIMITATIONS
This product is neither tested nor represented as suitable for medical or pharmaceutical uses.

USABLE LIFE AND STORAGE
Shelf life is 12 months from the production date found on the product label. Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed and head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen.